Maximum product size 4-12 inch wafers or products that support up to 300*300mm, compatible with wafers 12 inches and below
temperature range Room temperature ~1250℃
Temperature control method Fast PID temperature control
temperature uniformity Temperature uniformity at <500℃:±5℃, Temperature uniformity at>500℃:±1%
Maximum heating rate ≤25℃/s（SiC carrier disc）
